Inlays and Prelaminates
Cooperating with certified partners, ARE CON supplies inlays and pre-laminates for manufacturing ISO-standard cards as well as special formats in these categories:
- Low frequency (LF)
- High frequency (HF)
- Ultra-high frequency (UHF)
- Combination pre-laminates (HF/LF, UHF/HF UHF/LF)
- Pre-laminates with microprocessors
All our pre-laminates stand out for robust quality plus excellent bending and torsional properties. The high-end antennas are designed for optimal read ranges with the integrated chip. We can also implement your requirements regarding frequency resonance (Fres) and Q-factor.
We can position the antennas flexibly, e.g. to implant a contact chip and create a hybrid card. Equally, we can customise the antenna position any way you like for holes or special punching.
The inlays and pre-laminates are available in PVC, PET and polycarbonate.
As customer requirements are very varied, we draw up a detailed specification for every order, based on your drawing or instructions. (see: Generic Specification HF 2016 V01).
Use the checklist below to determine the criteria you want as the basis for your order.
|Chip Manufacturer||NXP / Infineon / Legic / Impinj / Alien Technology/ EM Microelectronic / Atmel etc.|
|Chip Type||Mifare …/ I-Code… / Legic… / EM… / Hitag … / ATA… / NTAG… / Monza… / Higgs… / UCODE…|
|Material||PVC, PET-G, PET-F, Polycarbonate|
|Sheet Format||all common formats resp. customer-specific|
|Antennas per Sheet||customer-specific|
|Color||white / transparent / opaque|
|Marks||for example position and reference marks|
|Max. rejects per Sheets||customer-specific|
|Technology||air coil / embedded / etched / printed antennas|
|Material specification||for example surface quality, manufacturer, grain direction etc.|
|Specification of module packaging||NOA3 / MCC2 / MCC8 / MOA4 / MOA8 / COB etc.|